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ATION
EVALU
AVAIL
19-2754; Rev 2; 11/05
KIT
ABLE
W-CDMA/W-TDD/TD-SCDMA Zero-IF Receivers
General Description
The MAX2390–MAX2393/MAX2396/MAX2400/MAX2401
(referred to as the “MAX2390 family”) fully integrated
direct-conversion receiver ICs are designed for W-CDMA
and TD-SCDMA applications.
The MAX2390 family of receiver ICs have over 90dB of
dynamic gain control, and typical noise figure of 2.7dB
referred to LNA input. Each receiver consists of an ultra-
low-current low-noise amplifier (LNA) with on-chip output
matching and a two-step gain control. The zero-IF
demodulator has a differential circuit topology for mini-
mum LO leakage to receiver’s input. The channel selec-
tivity is done completely in the baseband section of the
receiver with an on-chip lowpass filter. The AGC section
has over 50dB of gain-control range. LO quadrature
generation is done on-chip through a divide-by-2
prescaler. The DC offset cancellation in the I/Q baseband
channels is done fully on-chip using a DC servo loop. To
Features
? Fully Monolithic Direct-Conversion Receivers
? Eliminate External IF SAW + IF AGC + I/Q Demod
? Meet all 3GPP Receiver’s Standard Requirements
with at Least 3dB Margin on Eb/No
? Operate from a +2.7V to +3.3V Single Supply
? Over 90dB of RF+ Baseband Gain-Control Range
? Channel Selectivity Over 40dB
? Receiver Current Consumption ≈ 32mA
? On-Chip DC Offset Cancellation
? Compatible with Various CMOS Logic Levels
Pin Configurations/
Functional Diagrams
quickly correct for large DC offset transients in minimal
time, very fast settling time is obtained by optimization of
28
27
26
25
24
23
22
the DC-offset-cancellation circuit’s time constant.
The MAX2390 family includes a 3-wire serial bus for con-
figuring the different receiver modes. They also include a
SHDN pin for full device shutdown. The receivers are
V CC
RF+
RF-
1
2
3
SERIAL
INTERFACE
21 Q-
20 Q+
19 AGC
fabricated using an advanced high-frequency SiGe
BiCMOS process. The ICs operate from a single +2.7V to
BIAS
4
18 SHDN
+3.3V supply and are housed in a small 28-pin leadless
QFN-EP and thin QFN-EP packages (5mm x 5mm).
Applications
IMT2000 Handsets TD-SCDMA Handsets
V CC
G_LNA
LNA_OUT
5
6
7
MAX2390–MAX2393/
MAX2401
LNA
/2
TANK
INTEGER-N
PLL
17 LD
16 REFIN
15 V CC
UMTS Handsets
W-CDMA TDD Handsets
8
9
10
11
12
13
14
W-CDMA Band II (PCS)
W-CDMA Band III (DCS)
Handsets
Handsets
Pin Configurations continued at end of data sheet.
Ordering Information/Selector Guide
PART
TEMP RANGE
PIN-PACKAGE
APPLICATION
CHIP RATE (Mcps) RF BAND (MHz) SYNTHESIZER
MAX2390 ETI
MAX2391 ETI
MAX2391ETI+
MAX2392 ETI
MAX2392ETI+
MAX2393 EGI
MAX2396 EGI
MAX2400 ETI
MAX2401 ETI
MAX2401ETI+
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
28 Thin QFN-EP*
28 Thin QFN-EP*
28 Thin QFN-EP*
28 Thin QFN-EP*
28 Thin QFN-EP*
28 QFN-EP*
28 QFN-EP*
28 Thin QFN-EP*
28 Thin QFN-EP*
28 Thin QFN-EP*
W-CDMA Band II
IMT2000/UMTS
IMT2000/UMTS
TD-SCDMA
TD-SCDMA
W-TDD/TD-SCDMA
IMT2000/UMTS
W-CDMA Band II
W-CDMA Band III
W-CDMA Band III
3.84
3.84
3.84
1.28
1.28
3.84 or 1.28
3.84
3.84
3.84
2.84
1930 to 1990
2110 to 2170
2110 to 2170
2010 to 2025
2010 to 2025
1900 to 1920
2110 to 2170
1930 to 1990
1805 to 1880
1805 to 1880
On-Chip
On-Chip
On-Chip
On-Chip
On-Chip
On-Chip
External
External
On-Chip
On-Chip
* EP = Exposed paddle. + Denotes lead-free package.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
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